Thermal Filler Pads & Films
All Thermal Conductive Pads / Comparison

Our thermal gap fillers are available with and without adhesive tape and can be die cut to size upon request. Suitable for many electronics applications.

Features:
- Thermal conductivity from 1.7 ~ 11.0 W/mk
- Thickness from 0.30 ~ 15mm
- Silicone and non-silicone materials available 



 

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Thermal Conductive Silicone Film / P3T Series

Super thin, thermally conductive silicone film with thermal conductivity up to 4.0w/mk. Due to its fibreglass re-enforcement the thermal conductive film provides durability in harsh environments and yet its softness, 45 Shore 00, ensures good contact with un-even surfaces of electronic components. 

Features:
- Non-electrically conductive
- Available with or without adhesive tape
- Thickness from 0.25 - 0.75mm

 

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Thermal Filler Pads / W Series Pads

As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management.



 

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Thermal Non-Silicone Film / SFT Series

Our thermally conductive non-silicone film is suitable where there are concerns about the use of silicone. Our thermally conductive non-silicone films use a ceramic filled polyurethane. Can be supplied die-cut to a customer's specification.

Features:
- Thermal conductivity up to 6.0 w/mk
- Available with one side adhesive
- Good electrical insulation properties

 

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