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      • Choosing The Correct Thermal Pad
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      • Selecting a TIM For An Energy Battery Pack
      • Silicone vs Silicone-Free Thermal Pads
      • Solving The Heat Crisis of AI Data Centres
      • What Is Thermal Glue?
      • Why Choose a TIM With High Thermal Conductivity?
      • Why Thermal Impedance and Thermal Resistance Impact Performance
  • Latest News / Blog
  • Home
  • Products
    • Heatsinks
      • Ceramic Heatsink
    • Heat Pipes
      • Flat Aluminium Heat Pipes – MHP Series
      • Round Copper Heat Pipes – CHP Series
      • Pulsating Heat Pipes – PHP Series
    • Thermal Pads
      • Silicone Thermal Pads
      • Carbon Fibre Thermal Pad
      • Silicone Free Thermal Pads
      • Boron Nitride Thermal Pad
      • Graphene Thermal Pad
    • Thermal Tape
      • Thermal Adhesive Tape – FCT Series
      • Thermal Adhesive Tape – TH-10NF Series
    • Phase Change Material
      • Phase Change Pad – MPC300 Series
      • Phase Change Pad – MPC300AL Series
      • Phase Change Pad – MPC600 Series
    • Thermal Conductive Adhesive
      • Thermal Glue – TCG200 Series
    • Thermal Conductive Films
      • Carbon Copper Foil – CCF Series
      • Thermal Conductive Film – S10F35G Series
      • Silicone Free Conductive Film – SFT Series
      • Thermal Conductive Film – W2TR Series
    • Thermal Grease and Paste
      • Thermal Conductive Grease – MSC Series
      • Thermal Conductive Paste – ATP Series
    • Thermal Putty
      • Silicone Thermal Putty – WTP Series
      • Silicone Free Thermal Putty – WTP-NS Series
  • Contact us
    • Email Sales
    • Email Accounts
    • Sample Request
    • Quotation Request
  • About us
    • Ethical Charter
    • Privacy Policy
    • Website Terms of Use
  • Downloads
    • Application Examples
      • Automotive Electronics
      • Consumer Electronics
      • Energy Storage
    • Case Studies
      • Carbon Fibre Thermal Pads In Medical Devices
      • How Thermal Interface Materials Enhance GPUs
      • Improving Energy Efficiency In AI Data Centres
      • Thermal Interface Materials In AI Laptops
      • Thermal Interface Materials In AR and VR Headsets
      • Thermal Interface Materials In Smartphones
    • E-Catalogues
      • Ceramic Heat Sinks – MPC Series
      • Flat Heat Pipes – MHP Series
      • Pulsating Heat Pipes – PHP Series
      • Round Heat Pipes – CHP Series
    • White Papers
      • Choosing The Correct Thermal Pad
      • Comparing Advanced Thermal Pads
      • Guide To Boron Nitride Thermal Pads
      • How To Apply Thermal Paste
      • Resolving Thermal Glue Issues
      • Selecting a TIM For An Energy Battery Pack
      • Silicone vs Silicone-Free Thermal Pads
      • Solving The Heat Crisis of AI Data Centres
      • What Is Thermal Glue?
      • Why Choose a TIM With High Thermal Conductivity?
      • Why Thermal Impedance and Thermal Resistance Impact Performance
  • Latest News / Blog
  • Home
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  • Thermally Conductive Materials

European Office

  • AMEC Thermasol, Marcom
    House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP,
    United Kingdom
  • Tel: +44 (0)1493 668622​
  • sales@amecthermasol.co.uk​

Benelux Office

  • AMEC Thermasol, Van Asscherstraat 103, 2160 Wommelgem, Rollebeekstraat,
    Belgium,
    Europe
  • Tel: +32 (3) 3662072
  • sales@amecthermasol.co.uk​

Singapore Office

  • Marcom SG Pte Ltd
    1, Ang Mo Kio Industrial Park 2A, AMK Tech 1, #04-04, Singapore,
    568049
  • Tel: TBC
  • sales@amecthermasol.co.uk​

Taiwan Office

  • 4F, No.243, Dong Sec. 1, Guongming 6th Rd., Zhubei City,
    Hsinchu,
    30264, Taiwan (R.O.C.)
  • Tel: +88 69181 53809
  • sales@amecthermasol.co.uk​

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AMEC Thermasol is a division of Marcom Electronic Components (UK) Ltd

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