IC components for compact and slim electronic products are usually limited by the available space and height. The slim nature of micro porous ceramic heat sinks can provide a suitable cooling solution.
The entirely new material structure of a ceramic heat sink moves heat by air circulation (without external force) through the embedded radiation micro porous ceramic material such that the accompanying IC components can operate continuously in a given temperature environment.
The ceramic heat sink is non-electrical conductive, humidity and dust proof by its special material nature. With a long life span and simple assembly process (can be attached by applying thermal paste or thermal adhesive tape to the surface of any IC component). The ceramic heat sink saves not only assembly time but also material and labour costs.
Ceramic heat sinks are now adopted by IC of power under 10W while specially designed ones are also available for high-watt ICs.