Thermal Gap Filler / ATS Series

The ATS thermal gap filler is used to fill air gaps between components and heat sinks. The exceptional conformity of these materials enables them to cover uneven surfaces, thus transferring heat away from individual components or the entire board. 

Features:
- Thermal Conductivity: Up to 5.0W/mk.
- Hardness: Up to Shore 65 00. 
- Custom shapes and sizes available.
- Available with adhesive one or both sides.

Thermal Gap Filler / G Series

Thermal pad with low rebound that reduces strain on PCB and components. Non-flammable and non-electrically conductive, the G Series of thermal pads offers good compression and absorbs dimensional tolerances. 

Features:
- Thermal Conductivity: Up to 8.2W/mk.
- Hardness: Up to 90 Asker C. 
- Excellent long-term performance.
- Custom shapes and sizes available.

Thermal Gap Filler / W10TR600A

With a high thermal conductivity, medium hardness (80 Shore 00) and high tensile strength, the W10TR600A thermal pad is a good general purpose, competitively priced material. 

Features: 
- Thermal Conductivity: 6.0W/mk.
- Hardness: Shore 65 00. 
- Good durability in harsh environments.
- Custom shapes and sizes available. 

Thermal Gap Filler / W6TR315G

An ideal thermal interface material where significant heat needs to be moved away from small electronics. The thermal pad can mould itself to different component shapes, gaps and uneven surfaces. 

Features:
- Thermal Conductivity: 3.15W/mk.
- Hardness: Shore 15 00. 
- Low heat resistance.
- Custom shapes and sizes available. 
- Fibreglass reinforcement available. 

Thermal Gap Filler / W8TR170D

The W8TR170D thermal gap filler is an ideal solution for when good thermal performance is required but when a more firm material is needed. 

Features:
- Thermal Conductivity: 1.70W/mk.
- Hardness: Shore 65 00. 
- Cost effective solution
- Custom shapes and sizes available.
- Adhesive backing available. 

Thermal Gap Filler / W8TR500G

With its high thermal conductivity, the W8TR500G thermal pad is suitable for working environments where the temperature varies greatly. Can be supplied with either fibreglass reinforcement and/or adhesive upon request.

Features:
- Thermal Conductivity: 5.0W/mk.
- Hardness: 65 Shore 00. 
- Good in adverse environments.
- Custom shapes and sizes available.

Thermal Gap Fillers / WG Series

***MEETS RBA AND ISO 16949 STANDARDS***

The WG thermal pads are renowned for their exceptional softness and compressibility, making them extensively used to fill gaps between heat generating components and heat dissipating modules. 

Features:
- Thermal Conductivity: Up to 12.0W/mk.
- Hardness: 30-90 Shore 00.
- Adhesive backing and reinforcement available. 
- Custom Sizes and shapes available.