Non-silicone thermal paste / ATPN Series
The non-silicone thermal paste does not generate any siloxane gas, making it usable near contacts and switches, preventing contact failure. The thermal paste is ideal for eliminating air gaps between a heat sink and heat source.
*NEW PRODUCT*
Features:
- Compresses easily, absorbing dimensional tolerances.
- Ensures long term reliability.
- Thermal conductivity up to 4.5W/mk.
Thermal Conductive Grease / MSC Series
The MSC thermal grease has heavy concentration of high heat conductive metal oxides and fillers. It is used as an effective heat conducting agent acting between electronic parts and heat sink devices. It is ideal for filling micro gaps.
Features:
- Thermal conductivity: 3.2 W/mK
- Low thermal resistance.
- High performance.
- Easy to apply.
Thermal Conductive Paste / ATP Series
The ATP series of thermal paste is ideal for eliminating air gaps between a heat source and a heatsink. The molecular structure of the ATP thermal paste prevents leakage and vaporisation, ensuring long term reliability.
Features:
- Electrically Isolating
- Thermal Conductivity: up to 6.50W/mk
- Silicone Based
- Low rebound reduces load on electronic components.
- Compresses easily, absorbing dimensional tolerances.
