Thermal Conductive Paste / DP Series

The DP series of thermal paste is ideal for eliminating air gaps between a heat source and a heatsink. The molecular structure of the DP thermal paste prevents leakage and vaporisation, ensuring long term reliability. Electrically isolating, the DP series is ideal for electronic devices. 




Part Number Thermal Cond.
W/m-K
Specific Heat
kJ/kg-K
Specific Gravitiy
(g/cc)
Specific Volume
Resistance (Ohm · cm)
Temp Range °C Colour Colour Datasheet
DP-100 6.50 - 2.8 5.9 x 10 -40 ~ 200 Grey Grey Download
DP-200 4.80 - 2.6 7.2 x 10 -40 ~ 150 Grey Grey Download
Annotation

All specifications shown herein are typical values and are not guaranteed. It is recommended to test in application for suitability.