Thermal Conductive Paste / DP Series
The DP series of thermal paste is ideal for eliminating air gaps between a heat source and a heatsink. The molecular structure of the DP thermal paste prevents leakage and vaporisation, ensuring long term reliability. Electrically isolating, the DP series is ideal for electronic devices.
| Part Number | Thermal Cond. W/m-K |
Specific Heat kJ/kg-K |
Specific Gravitiy (g/cc) |
Specific Volume Resistance (Ohm · cm) |
Temp Range °C | Colour | Colour | Datasheet |
| DP-100 | 6.50 | - | 2.8 | 5.9 x 10 | -40 ~ 200 | Grey | Grey |  |
| DP-200 | 4.80 | - | 2.6 | 7.2 x 10 | -40 ~ 150 | Grey | Grey | |
Annotation
All specifications shown herein are typical values and are not guaranteed. It is recommended to test in application for suitability.
