Thermal Conductive Paste / DP Series

The DP series of thermal paste is ideal for eliminating air gaps between a heat source and a heatsink. The molecular structure of the DP thermal paste prevents leakage and vaporisation, ensuring long term reliability. Electrically isolating, the DP series is ideal for electronic devices. 

Part Number Thermal Cond.
Specific Heat
Specific Gravitiy
Specific Volume
Resistance (Ohm · cm)
Temp Range °C Colour Colour Datasheet
DP-100 6.50 - 2.8 5.9 x 10 -40 ~ 200 Grey Grey Download
DP-200 4.80 - 2.6 7.2 x 10 -40 ~ 150 Grey Grey Download

All specifications shown herein are typical values and are not guaranteed. It is recommended to test in application for suitability.