AMEC Thermasol markets a variety of Thermal Conductive Pads in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc.
Silicone & non-silicone thermal gap fillers available in thicknesses from 0.30~15.0mm and thermal conductivity from 1.7~11.0W/mk. Our thermal gap fillers are available with and without adhesive tape and can be die cut to size upon to request.
|Part Number||Thermal Cond.
|WG-15NS||1.5||65 Shore 00||>6||-40 ~ +120||0.3 ~ 10.0||Yes||-|
|WG-35NS||3.0||78 Shore 00||>6||-40 ~ +120||0.5 ~ 10.0||Yes||-|
All specifications shown herein are typical values and are not guaranteed. It is recommended to test in application for suitability.