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Thermal Tape / TH Series
The TH Series of Thermally Conductive Adhesive Tapes possess an extremely high Thermal Conductivity of 2.5W/mk and a low thermal impedance yet maintain a high bonding strength. The thermal adhesive tape can be used to replace Thermal Filler Pads, Thermal Grease with mechanical fixings. Applications include bonding Heat Sinks, Microprocessors, LEDs, and other high power semiconductors.
Features: Applications: |
Part Number | Thermal Conductivity | Volume Resistivity | Hardness | Holding Power (25°C / Hours) |
Holding Power (25°C / Hours) |
TH-10NF | 2.5W/m-K | 1014(Ω.cm) | 33 Shore A | >48 Hours | >48 Hours |
Annotation
All specifications shown herein are typical values and are not guaranteed. It is recommended to test in application for suitability.