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Thermal Tape / TH Series

The TH Series of Thermally Conductive Adhesive Tapes possess an extremely high Thermal Conductivity of 2.5W/mk and a low thermal impedance yet maintain a high bonding strength.

The thermal adhesive tape can be used to replace Thermal Filler Pads, Thermal Grease with mechanical fixings. Applications include bonding Heat Sinks, Microprocessors, LEDs, and other high power semiconductors.

Features:
- Thermal Conductivity 2.5 W/m-k
- High bond strength to a variety of surfaces.
- Double sided pressure sensitive adhesive tape.
- High performance thermally conductive acrylic adhesive.

Applications:
- Mounting heatsinks on BGA processor or drive processor.
- Mounting heat spreader onto PCB or onto motor control PCB.
- Can be used instead of heat cure adhesive, screw mounting or clip mounting.


Part Number Adhesive Type Carrier Type Continuous Use Temp Thickness Thickness Tolerance Voltage Breakdown Steel Adhesion
(g/25mm)		 Thermal Impedance
@50psi		 Datasheet
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Part Number Thermal Conductivity Volume Resistivity Hardness Holding Power
(25°C / Hours)		 Holding Power
(25°C / Hours)
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Annotation

All specifications shown herein are typical values and are not guaranteed. It is recommended to test in application for suitability.