We have recently expanded our range of thermal interface materials and can now offer thermal glue. The TCG200 Series is a single compound material primarily made of silicone resin. It offers good stability and long term high temperature resistance.
The thermal conductive glue also provides high bonding performance and is suited for use with automated dispensing equipment. This makes it an ideal solution for high volume applications. Another advantage of the high bonding level is that it eliminates the need to use screws or washers, thus reducing weight and size of the application.
Particularly suited for micro electronics and for coupling PCB board level components with a heat sink, the thermal glue provides a thin bond line and excellent thermal path.
Our TCG200 Series is ROHS and REACH SVHC compliant and halogen free. In addition to this it can meet RBA (Responsible Business Alliance) and ISO/TS 16949 requirements. Material is available to purchase in either 120ml or 300ml tube sizes.
If this material is of further interest then please see our datasheet for further information, or contact our sales team for pricing and/or samples.
