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Comparison Thermal Paste / Comparison

As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller packages, it will dissipate power in the form of heat and requires some degree of thermal management.



DP Series Thermal Paste / DP Series

Thermal Conductivity up to 6.5 W/mK
Electrically isolative, DP series is ideal for electronic devices
High dielectric properties up to 1.4 x 1014 ohm ยท cm



KTP Series Thermal Paste / KTP Series

High Performance Thermal Grease
Thermal Conductivity of 10 W/mK
Silicone Free



MGS Series Thermal Paste / MGS Series

General Purpose Thermal Grease
Thermal Conductivity up to 4.0 W/mK
Low viscosity and easy handling properties



MSC Series Thermal Paste / MSC Series

General purpose thermal grease
Thermal conductivity up to 3.2 W/mK
Suitable for LED, CPU & LED applications



TGP Series Thermal Paste / TGP Series

A thermal paste with a thermal conductivity of 6.0 W/mK.
Suitable for CPU,GPU & LED applications.
Available in syringes and tubs.




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