Author: marcom

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We have added a new material to our thermally conductive films range, the CCF conductive carbon copper foil, which has thermal conductivity of 400W/mk.

The thermal conductive film forms a good heat conduction path between the heating element and the heat sink member. This forms a heat dissipation module together with the heat sink and the structural fixing member (fan).

Carbon copper foil has a uniform carbon coating that provides optimum conductivity and energy transfer. Good electrochemical stability of the carbon copper foil improves product performance and lifespan.

Generally supplied in roll format, the CCF series can be supplied in custom shapes and sizes upon request. Ultra thin profile makes the TIM an idea solution for narrow enclosures. Typical applications include computers, servers, LED lighting, VR, tablets, mobile phones and laptops.

Please refer to our datasheet for further information. Should this material be of further interest then please do not hesitate to contact our sales team.

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AMEC Thermasol can now offer thermal phase change sheet with thermal conductivity of 6.0W/mk. The MPC600 PCM is typically used for filling gaps and transferring heat between components and heat sinks.

The phase change sheet offers good wet-out performance and low thermal impedance, effectively removing air from the contact surface. MPC600 is naturally tacky, easy to handle and can be supplied in custom sizes and shapes upon request.

Our thermal interface material meets ROHS 3 and ROHS SVHC requirements. In addition to this it is also halogen and silicone free and is manufactured to RBA and ISO/TS 16949 standards.

Please refer to our website datasheet for further information. If you require any pricing or samples then please do not hesitate to contact our sales team.

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We have recently extended our range of thermal putty and can now offer silicone free material with thermal conductivity up to 3.0W/mk. Thermal conductive putty can be re-worked, re-shaped and reused which gives the thermal putty a significant advantage over traditional thermal paste and grease.

Thermal putty can be easily applied and moulded to fit a variety of shapes and surfaces. This makes the thermal gap filler an ideal solution for irregular surfaces and applications with high mechanical tolerances, as the putty can easily adapt to the range of gaps it needs to fill. This gives it an advantage over traditional thermal pads.

The thermal putty is generally supplied in syringes which are compatible with automated dispenser machines, making the material an ideal solution for high volume applications. The dispenser machines can be used to apply the TIM to multiple heat sources in one assembly operation, thus reducing operating and BOM costs.

One further advantage with the WTP-NS silicone free putty is that it does not bleed silicone oil or cause siloxane volatility, an essential requirement for silicone sensitive components.

For further information please see our datasheet.

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Dear Customers

The ceramic raw material that is used to produce our MPC and FCH ceramic heat sink series is in the process of going end of life. Thankfully an alternative raw material has been sourced, although this is light grey in colour rather than dark grey.

Please be advised that the new raw material will not offer any difference in performance to the current material and is a colour change only. Currently we are working through our current stock of the current material, and will gradually transfer to the new coloured material once our current stocks are exhausted. As this is a colour change only, we will continue to use the current part numbers for the new coloured part numbers.

The below part numbers will be affected by this issue:

FCH252505T-V2
FCH303005T-V2
FCH404005T-V2
MPC101020T
MPC101030T
MPC151525T
MPC202025T
MPC222225T
MPC252525T
MPC303025T
MPC303050WT
MPC404025T
MPC404050WT

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We have recently extended our range of the TH-10NF thermal tape material and can now offer 0.3mm thickness: TH Series.

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Thermal conductive pad with thermal conductivity 20.0W/mk. Please refer to the link: WGCF20

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We have recently extended our range of silicone thermal pads and as a result we can now offer thermal conductivity up to 12w/mk. Please refer to the link: WG-S Series.

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We have recently extended our range of thermal putty, and as a result we can now offer thermal conductivity up to 6W/mk. Please refer to the link for further details: thermal putty.

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We have recently extended our range of non-silicone thermal pads, and as a result we can now offer thermal conductivity up to 8W/mk. Please refer to the link for further details: WG-NS Series.