Development of Microchannel Array
AMEC Thermasol have been working together with their customer Forced Physics in developing the microchannel array, which is the next generational electronic cooling solution. The
Formed in 2005 as a product division of MEC, AMEC Thermasol specialises in thermal interface materials. Our TIMs are suited for a wide variety of applications such as automotive, digital cameras, LED lighting, mobile phones, tablets and electronic test equipment. All products are REACH and ROHS compliant and samples of our components can be purchased upon request.
LATEST NEWS
AMEC Thermasol have been working together with their customer Forced Physics in developing the microchannel array, which is the next generational electronic cooling solution. The
We have recently extended our range of the TH-10NF thermal tape material and can now offer 0.3mm thickness: TH Series.
Thermal conductive pad with thermal conductivity 20.0W/mk. Please refer to the link: WGCF20
We have recently extended our range of silicone thermal pads and as a result we can now offer thermal conductivity up to 12w/mk. Please refer
We have recently extended our range of thermal putty, and as a result we can now offer thermal conductivity up to 6W/mk. Please refer to
We have recently extended our range of non-silicone thermal pads, and as a result we can now offer thermal conductivity up to 8W/mk. Please refer
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